In the summer and fall of 1998 we did a thermal study of CDF's COT ASDQ boards. See summary of results and figures of setup below.

------------------------------------------------------------------------------------- Summary of runs in vertical orientation with BLACK paint, no BLACK paint and with conductive epoxy on copper tubing. Tests on superlayer-8 test module inside 8-cu-ft insulated box - description of setup as presented at the COT Electronics group meeting 10/9/98. Run on 10/8/98, description and run data and summary results (with "old results" for comparison). Temperature profile across ASDQ board with 20.8 deg-C water and without ground braid connection to extruded aluminum. Run on 9/24/98. Temperature profile across ASDQ board with 22.1 deg-C water and without ground braid connection to extruded aluminum. Run on 9/23/98. Sketch showing a wider board with Cu-pads for lugs as presented at the Electronics meeting 9/25/98. This extra width was discussed but more study is needed for the final design. Written summary of results and suggestions for the next ASDQ daughter board as presented at the Electronics meeting 9/25/98. Table of summary of runs showing the effects of ground braids, black paint and cooling water on chip temperature, presented at the Electronics meeting 9/25/98. Temperature profile across ASDQ board with 68-deg-F water cooling, 9/10/98. The change here is that the ground braids, which went to the inside middle slot on the aluminum extrusion were replaced with a braid twice as thick and the connection is made to the TOP cover slot. The big improvement here is that now an individual ASDQ board can be taken out without removal of neighboring boards. The results are similar to previous runs with ground braids attached to the inside middle slots. Temperature profile across ASDQ board with 74.3-degree-F water cooling, 8/12/98. Temperature profile across ASDQ board with 80-degree-F water cooling, 8/11/98. Setup conditions and data with cooling water at room temperature studies 8/11-14/98. Setup conditions and data with cooling water studies 7/28-31/98. Temperature profile across ASDQ board with 55-degree-F water cooling, 7/28/98. Penn's COT Superlayer-8 Thermal Test Setup with 5 ASDQ Boards, schematic top view, 7/16/98. Side view, cross-section looking across one board, temperature profiles-Cu/G10 top cover, 7/16/98. Side view, cross-section looking across one board, temperature profiles-Aluminum top cover, 7/21/98. Temperature vs time for ASDQ heating Temperature vs time for ASDQ cooling Setup conditions and data for ground braid study, 7/9/98. Setup conditions and data for inside black paint study, 7/13/98.

Photo Album: Photos showing the Super-layer-8 1-foot 5-ASDQ daughter board Temperature measuring setup. These are GIF files.